Touch display device

ABSTRACT

A touch display device includes a touch planarization film. The touch planarization film may be disposed on an inclined portion of an encapsulation layer in a non-active area of a display panel, and a touch routing line may be disposed on the planarized area of the touch planarization film, so that it is possible to reduce parasitic capacitance between the touch routing line and a display signal line located under the encapsulation layer without increasing dimensions of the non-active area. Therefore, it is possible to easily adjust a width of the touch routing line and reduce the parasitic capacitance deviation between the touch routing lines, thereby improving the performance of the touch sensing.

CROSS REFERENCE TO RELATED APPLICATION

This application claims priority from Korean Patent Application No.10-2020-0161233, filed on Nov. 26, 2020, which is hereby incorporated byreference for all purposes as if fully set forth herein.

BACKGROUND Technical Field

Embodiments of the present disclosure are related to a touch displaydevice.

Description of the Related Art

The growth of the information society leads to increased demand fordisplay devices to display images and use of various types of displaydevices, such as liquid crystal display devices, organic light emittingdisplay devices, etc.

The display devices, for providing more various functions to a user,provide a function that recognizes a touch by a finger or a pen of theuser being contacted to a display panel and performs an input processbased on a recognized touch.

The display devices can comprise a plurality of touch electrodesdisposed on the display panel, or imbedded in the display panel. And thedisplay devices can sense a touch of the user to the display panel bydetecting a change of a capacitance occurred by the touch of the user.

The touch electrode disposed in the active area of the display panel maybe electrically connected to a touch driving circuit by a touch routingline disposed in the non-active area. In addition, there may be arrangeda plurality of lines to which a signal or voltage for driving a displayare applied in an area overlapping the area in which the touch routingline is disposed.

BRIEF SUMMARY

The inventors have realized that a parasitic capacitance may be formedbetween the touch routing line and the signal line for driving thedisplay, and there may be a problem that the accuracy of touch sensingmay be deteriorated due to the parasitic capacitance.

Embodiments of the present disclosure provide a method capable ofreducing the parasitic capacitance between touch routing line for touchsensing and signal line for driving display.

Embodiments of the present disclosure provide a method capable ofreducing the deviation of parasitic capacitance formed between the touchrouting line and the signal line for driving the display, and improvingthe uniformity and accuracy of touch sensing.

Embodiments of the present disclosure provide a touch display deviceincluding an encapsulation layer disposed on at least a portion of anon-active area and an active area, and including an inclined portionlocated in the non-active area, a plurality of touch electrodes locatedon the encapsulation layer in the active area, a plurality of touchrouting lines located on the encapsulation layer in the non-active areaand electrically coupled to at least one of the plurality of touchelectrodes, and a touch planarization film located outside the activearea, disposed in at least a portion of the non-active area, disposed onthe encapsulation layer in at least a portion of an area overlapping theinclined portion of the encapsulation layer, and located under theplurality of touch routing lines.

Embodiments of the present disclosure provide a touch display deviceincluding an encapsulation layer disposed on at least a portion of anon-active area and an active area, and including an inclined portionlocated in the non-active area, a touch buffer film located on theencapsulation layer, a plurality of touch electrodes and a plurality oftouch routing lines disposed on the touch buffer film, and a touchplanarization film disposed in the non-active area and disposed betweenat least a portion of the inclined portion of the encapsulation layerand the touch buffer film.

According to embodiments of the present disclosure, a touchplanarization film is disposed between an inclined portion of theencapsulation layer and a touch routing line in the non-active area of adisplay panel, so that it is possible to reduce parasitic capacitancebetween the touch routing line and a display signal line located underthe encapsulation layer.

According to embodiments of the present disclosure, it is possible toeasily adjust a width of the touch routing line by reducing theparasitic capacitance deviation between the touch routing lines and thedisplay signal line and reduce a load of the touch routing line, therebyimproving the uniformity and accuracy of touch sensing.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The above and other technical features and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a diagram illustrating a system configuration of a touchdisplay device according to embodiments of the present disclosure;

FIG. 2 is a diagram schematically illustrating a display panel of atouch display device according to embodiments of the present disclosure;

FIG. 3 is a diagram illustrating a structure in which a touch panel isdisposed as an in-cell structure in a display panel according toembodiments of the present disclosure;

FIGS. 4 and 5 are diagrams illustrating types of touch electrodesdisposed in a display panel according to embodiments of the presentdisclosure;

FIG. 6 is a diagram illustrating the mesh-shaped touch electrodeillustrated in FIG. 5 ;

FIG. 7 is a diagram schematically illustrating a touch sensor structurein a display panel according to embodiments of the present disclosure;

FIG. 8 is a diagram illustrating an example of the touch sensorstructure illustrated in FIG. 7 ;

FIG. 9 is a cross-sectional diagram illustrating portions of the displaypanel according to embodiments of the present disclosure, taken alongline X-X′ in FIG. 8 ;

FIGS. 10 and 11 are diagrams illustrating a cross-sectional structure ofa display panel according to embodiments of the present disclosure,including a color filter;

FIG. 12 is a diagram illustrating an example of a structure in which atouch routing line is disposed in a non-active area of a display panelaccording to embodiments of the present disclosure;

FIG. 13 is a diagram illustrating another example of a structure inwhich a touch routing line is disposed in a non-active area of a displaypanel according to embodiments of the present disclosure;

FIG. 14 is a diagram illustrating another example of a structure inwhich a touch routing line is disposed in a non-active area of a displaypanel according to embodiments of the present disclosure;

FIGS. 15 to 17 are diagrams illustrating structures in which touchrouting line is disposed in a non-active area of a display panelaccording to embodiments of the present disclosure.

DETAILED DESCRIPTION

In the following description of examples or embodiments of the presentdisclosure, reference will be made to the accompanying drawings in whichit is shown by way of illustration specific examples or embodiments thatcan be implemented, and in which the same reference numerals and signscan be used to designate the same or like components even when they areshown in different accompanying drawings from one another. Further, inthe following description of examples or embodiments of the presentdisclosure, detailed descriptions of well-known functions and componentsincorporated herein will be omitted when it is determined that thedescription may make the subject matter in some embodiments of thepresent disclosure rather unclear. The terms such as “including,”“having,” “containing,” “constituting” “make up of,” and “formed of”used herein are generally intended to allow other components to be addedunless the terms are used with the term “only.” As used herein, singularforms are intended to include plural forms unless the context clearlyindicates otherwise.

Terms, such as “first,” “second,” “A,” “B,” “(A),” or “(B)” may be usedherein to describe elements of the present disclosure. Each of theseterms is not used to define essence, order, sequence, or number ofelements, etc., but is used merely to distinguish the correspondingelement from other elements.

When it is mentioned that a first element “is connected or coupled to,”“contacts or overlaps,” etc., a second element, it should be interpretedthat, not only can the first element “be directly connected or coupledto” or “directly contact or overlap” the second element, but a thirdelement can also be “interposed” between the first and second elements,or the first and second elements can “be connected or coupled to,”“contact or overlap,” etc., each other via a fourth element. Here, thesecond element may be included in at least one of two or more elementsthat “are connected or coupled to,” “contact or overlap,” etc., eachother.

When time relative terms, such as “after,” “subsequent to,” “next,”“before,” and the like, are used to describe processes or operations ofelements or configurations, or flows or steps in operating, processing,manufacturing methods, these terms may be used to describenon-consecutive or non-sequential processes or operations unless theterm “directly” or “immediately” is used together.

In addition, when any dimensions, relative sizes, etc., are mentioned,it should be considered that numerical values for an elements orfeatures, or corresponding information (e.g., level, range, etc.)include a tolerance or error range that may be caused by various factors(e.g., process factors, internal or external impact, noise, etc.) evenwhen a relevant description is not specified. Further, the term “may”fully encompasses all the meanings of the term “can.”

FIG. 1 is a diagram illustrating a system configuration of a touchdisplay device according to embodiments.

Referring to FIG. 1 , the touch display device according to embodimentsof the present disclosure can provide both an image display function anda touch-sensing function.

To provide the image display function, the touch display deviceaccording to embodiments of the present disclosure can comprise: adisplay panel DISP in which a plurality of data lines and a plurality ofgate lines are disposed and a plurality of subpixels corresponding tothe plurality of data lines and the plurality of gate lines are arrayed;a data driver (or data driver circuit) DDC driving the plurality of datalines; a gate driver (or gate driver circuit) GDC driving the pluralityof gate lines; a display controller DCTR controlling the data driver DDCand gate driver GDC, and the like.

Each of the data driver DDC, the gate driver GDC, and the displaycontroller DCTR can be implemented as one or more separate components.In some cases, two or more of the data driver DDC, the gate driver GDC,and the display controller DCTR can be integrated into a singlecomponent. For example, the data driver DDC and the display controllerDCTR can be implemented as a single integrated circuit (IC) chip.

To provide the touch-sensing function, the touch display deviceaccording to embodiments of the present disclosure can comprise: a touchpanel TSP including a plurality of touch electrodes; and a touch-sensingcircuit TSC supplying a touch driving signal to the touch panel TSP,detecting a touch-sensing signal from the touch panel TSP, and detectinga touch of a user or determining a touch position (touch coordinates) onthe touch panel TSP on the basis of a detected touch-sensing signal.

For example, the touch-sensing circuit TSC can comprise: a touch drivingcircuit TDC supplying a touch driving signal to the touch panel TSP anddetecting a touch-sensing signal from the touch panel TSP; a touchcontroller TCTR determining at least one of the touch of the user andthe touch coordinates on the basis of the touch-sensing signal detectedby the touch driving circuit TDC, and the like.

The touch driving circuit TDC can comprise a first circuit partsupplying the touch driving signal to the touch panel TSP and a secondcircuit part detecting the touch-sensing signal from the touch panelTSP.

The touch driving circuit TDC and the touch controller TCTR can beprovided as separate components or, in some cases, can be integratedinto a single component.

In addition, each of the data driver DDC, the gate driver GDC, and thetouch driving circuit TDC is implemented as one or more ICs, and interms of electrical connection to the display panel DISP, can have achip-on-glass (COG) structure, a chip-on-film (COF) structure, a tapecarrier package (TCP) structure, or the like. In addition, the gatedriver GDC can have a gate-in-panel (GIP) structure.

In addition, each of the circuit configurations DDC, GDC, and DCTR fordisplay driving and the circuit configurations TDC and TCTR for touchsensing can be implemented as one or more separate components. In somecases, one or more of the display driving circuit configurations DDC,GDC, and DCTR and one or more of the touch-sensing circuitconfigurations TDC and TCTR can be functionally integrated into one ormore components.

For example, the data driver DDC and the touch driving circuit TDC canbe integrated into one or more IC chips. In a case in which the datadriver DDC and the touch driving circuit TDC are integrated into two ormore IC chips, each of the two or more IC chips can have both a datadriving function and a touch driving function.

In addition, the touch display device according to embodiments of thepresent disclosure can be various types of devices, such as an organiclight-emitting diode (OLED) display device and a liquid crystal display(LCD) device. Hereinafter, the touch display device will be described asan OLED display device for the sake of brevity. That is, although thedisplay panel DISP can be various types of devices, such as an OLED andan LCD, the display panel DISP will be described as an OLED panel as anexample for the sake of brevity.

In addition, as will be described later, the touch panel TSP cancomprise a plurality of touch electrodes to which the touch drivingsignal is applicable or from which the touch-sensing signal isdetectable; a plurality of touch routing lines connecting the pluralityof touch electrodes to the touch driving circuit TDC; and the like.

The touch panel TSP can be located outside of the display panel DISP.That is, the touch panel TSP and the display panel DISP can befabricated separately and combined thereafter. Such a touch panel TSP isreferred to as an add-on touch panel.

Alternatively, the touch panel TSP can be disposed inside of the displaypanel DISP. That is, when the display panel DISP is fabricated, touchsensor structures of the touch panel TSP, including the plurality oftouch electrodes, the plurality of touch routing lines, and the like,can be provided together with electrodes and signal lines used for thedisplay driving. Such a touch panel TSP is referred to as an in-celltouch panel. Hereinafter, for the sake of brevity, the touch panel TSPwill be described as an in-cell touch panel TSP as an example.

FIG. 2 is a diagram schematically illustrating the display panel DISP ofthe touch display device according to embodiments of the presentdisclosure.

Referring to FIG. 2 , the display panel DISP can comprise an active areaAA on which images are displayed and a non-active area NA locatedoutside of an outer boundary line BL of the active area AA.

In the active area AA of the display panel DISP, a plurality ofsubpixels for displaying images are arranged, and a variety ofelectrodes and signal lines for the display driving area are disposed.

In addition, the plurality of touch electrodes for the touch sensing,the plurality of touch routing lines electrically connected to theplurality of touch electrodes, and the like can be disposed in theactive area AA of the display panel DISP. Accordingly, the active areaAA can also be referred to as a touch-sensing area in which the touchsensing can be performed.

In the non-active area NA of the display panel DISP, link lines producedby extending a variety of signal lines disposed in the active area AA orlink lines electrically connected to the variety of signal linesdisposed in the active area AA and pads electrically connected to thelink lines can be disposed. The pads disposed in the non-active area NAcan be bonded or electrically connected to the display driving circuits,such as DDC and GDC.

In addition, in the non-active area NA of the display panel DISP, linklines produced by extending a plurality of touch routing lines disposedin the active area AA or link lines electrically connected to theplurality of touch routing lines disposed in the active area AA and padselectrically connected to the link lines can be disposed. The padsdisposed in the non-active area NA can be bonded or electricallyconnected to the touch driving circuit TDC.

In the non-active area NA, portions produced by expanding portions ofthe outermost touch electrodes among the plurality of touch electrodesdisposed in the active area AA can be provided, and one or moreelectrodes (e.g., touch electrodes) made of substantially the samematerial as the plurality of touch electrodes disposed in the activearea AA can be further disposed.

That is, the entirety of the plurality of touch electrodes disposed inthe display panel DISP can be located in the active area AA, specifictouch electrodes (e.g., the outermost touch electrodes) among theplurality of touch electrodes disposed in the display panel DISP can belocated in the non-active area NA, or specific touch electrodes (e.g.,the outermost touch electrodes) among the plurality of touch electrodesdisposed in the display panel DISP can extend across at least a portionof the active area AA and at least a portion of the non-active area NA.

In addition, referring to FIG. 2 , the display panel DISP of the touchdisplay device according to embodiments of the present disclosure cancomprise a dam area DA in which a dam DAM (see FIG. 9 ) is disposed, thedam DAM serving to prevent a layer (e.g., an encapsulation layer in theOLED display panel) in the active area AA from collapsing.

The dam area DA can be located at the boundary between the active areaAA and the non-active area NA, in a location of the non-active area NAat the periphery of the active area AA, or the like.

The dam disposed in the dam area DA can be disposed to surround theactive area AA in all directions or only at the periphery of one or moreportions (e.g., portions in which a fragile layer is located) of theactive area AA.

The dams disposed in the dam area DA can be connected to be made as asingle pattern or to be made as two or more separate patterns. Inaddition, in the dam area DA, only a first dam can be disposed, or twodams (e.g., a first dam and a second dam) can be disposed, or three ormore dams can be disposed.

In the dam area DA, the first dam can only be provided in one direction,and both the first dam and the second dam can be provided in the otherdirection.

FIG. 3 is a diagram illustrating a structure in which the touch panelTSP is disposed as an in-cell structure in the display panel DISPaccording to embodiments of the present disclosure.

Referring to FIG. 3 , a plurality of subpixels SP are arrayed on asubstrate SUB in the active area AA of the display panel DISP.

Each of the subpixels SP can comprise an emitting device ED, a firsttransistor T1 driving the emitting device ED, a second transistor T2delivering a data voltage VDATA to a first node N1 of the firsttransistor T1, a storage capacitor Cst maintaining a predeterminedvoltage or selected voltage for a single frame, and the like.

The first transistor T1 can comprise the first node N1 to which the datavoltage VDATA is applicable, a second node N2 electrically connected tothe emitting device ED, and a third node N3 to which a driving voltageVDD is applied from a driving voltage line DVL. The first node N1 can bea gate node, the second node N2 can be a source node or a drain node,and the third node N3 can be a drain node or a source node. Such a firsttransistor T1 is also referred to as a driving transistor driving theemitting device ED.

The emitting device ED can comprise a first electrode (e.g., an anode),an emissive layer, and a second electrode (e.g., a cathode). The firstelectrode can be electrically connected to the second node N2 of thefirst transistor T1, and the second electrode can have a base voltageVSS applied thereto.

The emissive layer of the emitting device ED can be an organic emissivelayer containing an organic material. In this case, the emitting deviceED can be an organic light-emitting diode (OLED).

The second transistor T2 can be on/off controlled by a scan signal SCANapplied through a gate line GL and be electrically connected to thefirst node N1 of the first transistor T1 and a data line DL. Such asecond transistor T2 is also referred to as a switching transistor.

When the second transistor T2 is turned on by the scan signal SCAN, thesecond transistor T2 delivers the data voltage VDATA supplied throughthe data line DL to the first node N1 of the first transistor T1.

The storage capacitor Cst can be electrically connected to the firstnode N1 and the second node N2 of the first transistor T1.

As illustrated in FIG. 3 , each of the subpixels SP can have a 2T1Cstructure comprised of two transistors T1 and T2 and a single capacitorCst. In some cases, each of the subpixels SP can further comprise one ormore transistors or one or more capacitors.

The storage capacitor Cst can be an external capacitor intentionallydesigned to be disposed externally of the first transistor T1, ratherthan a parasitic capacitor (e.g., Cgs or Cgd), e.g., an internalcapacitor present between the first node N1 and the second node N2 ofthe first transistor T1.

Each of the first transistor T1 and the second transistor T2 can be ann-type transistor or a p-type transistor.

As described above, circuit components, including the emitting deviceED, two or more transistors T1 and T2, and one or more capacitor Cst,are disposed in the display panel DISP. Since such circuit components(in particular, the emitting device ED) are vulnerable to externalmoisture, oxygen, or the like, an encapsulation layer ENCAP preventingexternal moisture or oxygen from penetrating the circuit components (inparticular, the emitting device ED) can be disposed in the display panelDISP.

Such an encapsulation layer ENCAP can be a single layer or have amultilayer structure.

In addition, in the touch display device according to embodiments of thepresent disclosure, the touch panel TSP can be disposed on theencapsulation layer ENCAP.

That is, in the touch display device, a touch sensor structure,including the plurality of touch electrodes TE, of the touch panel TSPcan be disposed on the encapsulation layer ENCAP.

In the touch sensing, the touch driving signal can be applied to thetouch electrodes TE, or the touch-sensing signal can be detected fromthe touch electrodes TE. Then, in the touch sensing, a potentialdifference can be produced between a touch electrode TE and a cathodedisposed on both sides of the encapsulation layer ENCAP, therebygenerating unnecessary parasitic capacitance. Since such parasiticcapacitance can reduce touch sensitivity, the distance between the touchelectrode TE and the cathode can be designed to be a predetermined valueor selected value (e.g., 1 μm) or more in consideration of the thicknessof the panel, a panel fabrication process, display performance, and thelike in order to reduce the parasitic capacitance. In this regard, forexample, the thickness of the encapsulation layer ENCAP can be designedto be 1 μm or more.

FIGS. 4 and 5 are diagrams illustrating types of touch electrodes TEdisposed in the display panel DISP according to embodiments of thepresent disclosure.

As illustrated in FIG. 4 , each of the touch electrodes TE disposed inthe display panel DISP can be a plate-shaped electrode metal without anopen area. In this case, each of the touch electrodes TE can be atransparent electrode. That is, each of the touch electrodes TE can bemade of a transparent electrode material such that light emitted by theplurality of subpixels SP disposed below the touch electrodes TE canpass through the touch electrodes TE.

Alternatively, as illustrated in FIG. 5 , each of the touch electrodesTE disposed in the display panel DISP can be an electrode metal EM inthe shape of a patterned mesh having two or more open areas OA.

The electrode metal EM is a portion substantially corresponding to thetouch electrode TE and is a portion to which the touch driving signal isapplied or from which the touch-sensing signal is detected.

As illustrated in FIG. 5 , in a case in which each of the touchelectrodes TE is the electrode metal EM in the shape of a patternedmesh, two or more open areas OA can be present in the area of the touchelectrode TE.

Each of the plurality of open areas OA provided in each of the touchelectrodes TE can correspond to the emitting area of one or moresubpixels SP. That is, the plurality of open areas OA are passagesallowing light emitted from the plurality of subpixels SP locatedtherebelow to pass upward therethrough. Hereinafter, for the sake ofbrevity, each of the touch electrodes TE will be described as amesh-shaped electrode metal EM as an example.

The electrode metal EM corresponding to each of the touch electrodes TEcan be located on a bank disposed in an area, except for the emittingarea of two or more subpixels SP.

In addition, a method of fabricating a plurality of touch electrode TEcan comprise making a mesh-shaped electrode metal EM having a wider areaand then cutting the electrode metal EM to be made as a predeterminedpattern or selected pattern, such that portions of the electrode metalEM are electrically separated from each other, thereby fabricating aplurality of touch electrodes TE.

The outline of the touch electrode TE can have a rectangular shape, suchas a diamond or a rhombus shape, as illustrated in FIGS. 4 and 5 , or avariety of other shapes, such as a triangle, a pentagon, or a hexagon.

FIG. 6 is a diagram illustrating the mesh-shaped touch electrode TEillustrated in FIG. 5 .

Referring to FIG. 6 , in the area of each of the touch electrodes TE,one or more dummy metals DM disconnected from the mesh-shaped electrodemetal EM can be provided.

The electrode metal EM is a portion substantially corresponding to thetouch electrode TE and is a portion to which the touch driving signal isapplied or from which the touch-sensing signal is detected. In contrast,the dummy metals DM are portions to which the touch driving signal isnot applied and from which the touch-sensing signal is not detected,although the dummy metals DM are portions located in the area of thetouch electrode TE. That is, the dummy metals DM can be electricallyfloating metals.

Thus, the electrode metal EM can be electrically connected to the touchdriving circuit TDC, but none of the dummy metals DM are electricallyconnected to the touch driving circuit TDC.

In the area of each of the entire touch electrodes TE, one or more dummymetals DM can be provided while being disconnected from the electrodemetals EM. Although FIG. 6 illustrates an example of a structure thatthe dummy metal DM is disposed on some area in an area of the touchelectrode TE, the dummy metal DM can be present on whole area in thearea of the touch electrode TE. Furthermore, the touch electrode TE caninclude the dummy metal DM or may not include the dummy metal DM,according to locations where the touch electrode TE is disposed.

For example, one or more dummy metal DM can be present to be separatedfrom the electrode metal EM only in an area of each of some touchelectrode TE of all touch electrodes TE. That is, the dummy metal DM maynot be present in an area of some touch electrode TE.

The function of the dummy metals DM is related to a visibility issue. Ina case in which only the mesh-shaped electrode metal EM is present inthe area of the touch electrode TE without one or more dummy metals DMbeing present in the area of the touch electrode TE as illustrated inFIG. 5 , the outline of the electrode metal EM can appear on the screen,thereby causing a visibility issue.

In contrast, in a case in which one or more dummy metals DM are presentin the area of the touch electrode TE as illustrated in FIG. 6 , theoutline of the electrode metal EM appearing on the screen, e.g., thevisibility issue, can be prevented.

In addition, touch sensitivity can be improved by adjusting themagnitude of capacitance according to each of the touch electrodes TE byadjusting the presence or absence or the number (or ratio) of the dummymetals DM of each of the touch electrodes TE.

In addition, specific points of the electrode metal EM provided in thearea of a single touch electrode TE can be cut, so that the cutelectrode metal EM form dummy metals DM. That is, the electrode metal EMand the dummy metals DM can be made of substantially the same materialprovided on the same layer.

In addition, the touch display device according to embodiments of thepresent disclosure can detect a touch on the basis of capacitancegenerated on the touch electrode TE.

The touch display device according to embodiments of the presentdisclosure can detect a touch by a capacitance-based touch sensingmethod, more particularly, mutual capacitance-based touch sensing orself-capacitance-based touch sensing.

In the mutual capacitance-based touch sensing, the plurality of touchelectrodes TE can be divided into driving touch electrodes (ortransmitting touch electrodes) to which the touch driving signal isapplied and sensing touch electrodes (or receiving touch electrodes)detecting the touch sensing signal and generating capacitance togetherwith the driving touch electrodes.

In the mutual capacitance-based touch sensing, the touch-sensing circuitTSC detects a touch and determines touch coordinates on the basis ofchanges in the capacitance (e.g., mutual capacitance) occurring betweenthe driving touch electrodes and the sensing touch electrodes, dependingon the presence or absence of a pointer, such as a finger or a pen.

In the self-capacitance-based touch sensing, each of the touchelectrodes TE serves as both a driving touch electrode and a sensingtouch electrode. That is, the touch-sensing circuit TSC detects a touchand determines touch coordinates by applying the touch driving signal toone or more touch electrodes TE, detecting the touch-sensing signalthrough the touch electrode TE to which the touch driving signal isapplied, and recognizing changes in the capacitance between the pointer,such as a finger or a pen, and the touch electrode TE, on the basis ofthe detected touch-sensing signal. Accordingly, in theself-capacitance-based touch sensing, there is no difference between thedriving touch electrodes and the sensing touch electrodes.

As described above, the touch display device according to embodiments ofthe present disclosure can perform the touch sensing by the mutualcapacitance-based touch sensing or the self-capacitance-based touchsensing. Hereinafter, for the sake of brevity, the touch display deviceperforming the mutual capacitance-based touch sensing and having a touchsensor structure for the mutual capacitance-based touch sensing will bedescribed as an example.

FIG. 7 is a diagram schematically illustrating a touch sensor structurein the display panel DISP according to embodiments of the presentdisclosure, and FIG. 8 is a diagram illustrating an example of the touchsensor structure illustrated in FIG. 7 .

Referring to FIG. 7 , the touch sensor structure for the mutualcapacitance-based touch sensing can comprise a plurality of X-touchelectrode lines X-TEL and a plurality of Y-touch electrode lines Y-TEL.Here, the plurality of X-touch electrode lines X-TEL and the pluralityof Y-touch electrode lines Y-TEL are located on the encapsulation layerENCAP.

Each of the plurality of X-touch electrode lines X-TEL can be disposedin a first direction, and each of the plurality of Y-touch electrodelines Y-TEL can be disposed in a second direction different from thefirst direction.

Herein, the first direction and the second direction can be differentdirections. For example, the first direction can be the X-axisdirection, while the second direction can be the Y-axis direction.Alternatively, the first direction can be the Y-axis direction, whilethe second direction can be the X-axis direction. In addition, the firstdirection and the second direction can or cannot overlapperpendicularly. In addition, the terms “column” and “row” as usedherein are relative terms. The column and the row can be switcheddepending on the viewing perspective.

Each of the plurality of X-touch electrode lines X-TEL can be comprisedof a plurality of X-touch electrodes X-TE electrically connected to eachother. Each of the plurality of Y-touch electrode lines Y-TEL can becomprised of a plurality of Y-touch electrodes Y-TE electricallyconnected to each other.

Here, the plurality of X-touch electrodes X-TE and the plurality ofY-touch electrodes Y-TE are electrodes included in the plurality oftouch electrodes TE, and have different functions.

For example, the plurality of X-touch electrodes X-TE constituting eachof the plurality of X-touch electrode lines X-TEL can be the drivingtouch electrodes, while the plurality of Y-touch electrodes Y-TEconstituting each of the plurality of Y-touch electrode lines Y-TEL canbe the sensing touch electrodes. In this case, each of the plurality ofX-touch electrode lines X-TEL corresponds to a driving touch electrodelines, and each of the plurality of Y-touch electrode lines Y-TELcorresponds to a sensing touch electrode line.

Alternatively, the plurality of X-touch electrodes X-TE constitutingeach of the plurality of X-touch electrode lines X-TEL can be thesensing touch electrodes, while the plurality of Y-touch electrodes Y-TEconstituting each of the plurality of Y-touch electrode lines Y-TEL canbe the driving touch electrodes. In this case, each of the plurality ofX-touch electrode lines X-TEL corresponds to the sensing touch electrodeline, and each of the plurality of Y-touch electrode lines Y-TELcorresponds to the driving touch electrode line.

A touch sensor metal TSM for the touch sensing can comprise a pluralityof touch routing lines TL in addition to the plurality of X-touchelectrode lines X-TEL and the plurality of Y-touch electrode linesY-TEL.

The plurality of touch routing lines TL can comprise one or more X-touchrouting lines X-TL connected to the plurality of X-touch electrode linesX-TEL, respectively, and one or more Y-touch routing lines Y-TLconnected to the plurality of Y-touch electrode lines Y-TEL,respectively.

Referring to FIG. 8 , each of the plurality of X-touch electrode linesX-TEL can comprise a plurality of X-touch electrodes X-TE disposed inthe same row (or column) and one or more X-touch electrode connectinglines X-CL electrically connecting the plurality of X-touch electrodesX-TE. Here, the X-touch electrode connecting lines X-CL respectivelyconnecting two adjacent X-touch electrodes X-TE can be metals integratedwith the two adjacent X-touch electrodes X-TE (see FIG. 8 ) or metalsconnected to the two adjacent X-touch electrodes X-TE via contact holes.

Each of the plurality of Y-touch electrode lines Y-TEL can comprise aplurality of Y-touch electrodes Y-TE disposed in the same column (orrow) and one or more Y-touch electrode connecting lines Y-CLelectrically connecting the plurality of Y-touch electrodes Y-TE. Here,the Y-touch electrode connecting lines Y-CL respectively connecting twoadjacent Y-touch electrodes Y-TE can be metals integrated with the twoadjacent Y-touch electrodes Y-TE or metals connected to the two adjacentY-touch electrodes Y-TE via contact holes (see FIG. 8 ).

In areas in which the X-touch electrode lines X-TEL overlap the Y-touchelectrode lines Y-TEL (e.g., touch electrode line overlapping areas),the X-touch electrode connecting lines X-CL can overlap the Y-touchelectrode connecting lines Y-CL.

In one embodiment, the X-touch electrode connecting lines X-CL overlapthe Y-touch electrode connecting lines Y-CL in the touch electrode lineoverlapping areas as described above, and the X-touch electrodeconnecting lines X-CL are located on a layer different from that of theY-touch electrode connecting lines Y-CL.

Accordingly, the plurality of X-touch electrodes X-TE, the plurality ofX-touch electrode connecting lines X-CL, the plurality of Y-touchelectrodes Y-TE, and the plurality of Y-touch electrode connecting linesY-CL can be located on two or more layers, such that the plurality ofX-touch electrode lines X-TEL overlap the plurality of Y-touch electrodelines Y-TEL.

Referring to FIG. 8 , each of the plurality of X-touch electrode linesX-TEL is electrically connected to a corresponding X-touch pad X-TPthrough one or more X-touch routing lines X-TL. That is, the outermostX-touch electrode X-TE among the plurality of X-touch electrodes X-TEincluded in a single X-touch electrode line X-TEL is electricallyconnected to a corresponding X-touch pad X-TP via the X-touch routingline X-TL.

Each of the plurality of Y-touch electrode lines Y-TEL is electricallyconnected to corresponding Y-touch pads Y-TP through one or more Y-touchrouting lines Y-TL. That is, the outermost Y-touch electrodes Y-TE amongthe plurality of Y-touch electrodes Y-TE included in a single Y-touchelectrode line Y-TEL is electrically connected to the correspondingY-touch pads Y-TP through the Y-touch routing lines Y-TL.

In addition, as illustrated in FIG. 8 , the plurality of X-touchelectrode lines X-TEL and the plurality of Y-touch electrode lines Y-TELcan be disposed on the encapsulation layer ENCAP. That is, the pluralityof X-touch electrodes X-TE, constituting the plurality of X-touchelectrode lines X-TEL, and the plurality of X-touch electrode connectinglines X-CL can be disposed on the encapsulation layer ENCAP. Theplurality of Y-touch electrodes Y-TE, constituting the plurality ofY-touch electrode lines Y-TEL, and the plurality of Y-touch electrodeconnecting lines Y-CL can be disposed on the encapsulation layer ENCAP.

In addition, as illustrated in FIG. 8 , the plurality of X-touch routinglines X-TL electrically connected to the plurality of X-touch electrodelines X-TEL can be disposed on the encapsulation layer ENCAP and extendto a location in which the encapsulation layer ENCAP is not provided,thereby being electrically connected to a plurality of X-touch padsX-TP, respectively. The plurality of Y-touch routing lines Y-TLelectrically connected to the plurality of Y-touch electrode lines Y-TELcan be disposed on the encapsulation layer ENCAP and extend to alocation in which encapsulation layer ENCAP is not provided, therebybeing electrically connected to a plurality of Y-touch pads Y-TP,respectively. Here, the encapsulation layer ENCAP can be located in theactive area AA and, in some cases, can expand to the non-active area NA.

In addition, as described above, a dam area DA can be provided at theboundary between the active area AA and the non-active area NA or in thenon-active area NA at the periphery of the active area AA in order toprevent a layer (e.g., an encapsulation in the OLED display panel) inthe active area AA from collapsing.

As illustrated in FIG. 8 , for example, a first dam DAM1 and a seconddam DAM2 can be disposed in the dam area DA. Here, the second dam DAM2can be located more outward than the first dam DAM1.

In a manner different from that illustrated in FIG. 8 , only the firstdam DAM1 can be located in the dam area DA. In some cases, not only thefirst dam DAM1 and the second dam DAM2 but also one or more additionaldam can be disposed in the dam area DA.

Referring to FIG. 8 , the encapsulation layer ENCAP can be located on aside of the first dam DAM1 or be located both on a side of and above thefirst dam DAM1.

FIG. 9 is a cross-sectional diagram illustrating portions of the displaypanel DISP according to embodiments of the present disclosure, takenalong line X-X′ in FIG. 8 . In FIG. 9 , the touch electrode TE isillustrated in the shape of a plate. However, this is illustrative only,and the touch electrode TE can be mesh shaped. In a case in which thetouch electrode TE is mesh shaped, the open areas OA of the touchelectrode TE can be located above the emissive areas of subpixels SP.

The first transistor T1, e.g., the driving transistor in each of thesubpixels SP in the active area AA, is disposed on the substrate SUB.

The first transistor T1 comprises a first node electrode NE1corresponding to the gate electrode, a second node electrode NE2corresponding to a source electrode or a drain electrode, a third nodeelectrode NE3 corresponding to a drain electrode or a source electrode,a semiconductor layer SEMI, and the like.

The first node electrode NE1 and the semiconductor layer SEMI can belocated on both sides of a gate insulating film GI to overlap eachother. The second node electrode NE2 can be provided on an interlayerinsulating film ILD to be in contact with one side of the semiconductorlayer SEMI, while the third node electrode NE3 can be provided on theinterlayer insulating film ILD to be in contact with the other side ofthe semiconductor layer SEMI.

The emitting device ED can comprise a first electrode E1 correspondingto an anode (or cathode), an emitting layer EL provided on the firstelectrode E1, a second electrode E2 corresponding to a cathode (oranode) provided on the emitting layer EL, and the like.

The first electrode E1 is electrically connected to the second nodeelectrode NE2 of the first transistor T1, exposed through a pixelcontact hole extending through a planarization layer PLN.

The emitting layer EL is provided on the first electrode E1 in theemitting area provided by banks BANK. The emitting layer EL is providedon the first electrode E1 and is comprised of a hole-related layer, anemissive layer, and an electron-related layer stacked in the statedorder or inversely. The second electrode E2 is provided on the side ofthe emitting layer EL opposite to the first electrode E1.

The encapsulation layer ENCAP prevents external moisture or oxygen frompenetrating the emitting device ED vulnerable to external moisture,oxygen, or the like.

The encapsulation layer ENCAP can be a single layer or, as illustratedin FIG. 9 , be comprised of a plurality of layers PAS1, PCL, and PAS2.

For example, in a case in which the encapsulation layer ENCAP iscomprised of the plurality of layers PAS1, PCL, and PAS2, theencapsulation layer ENCAP can comprise one or more inorganicencapsulation layers PAS1 and PAS2 and one or more organic encapsulationlayers PCL. As a specific example, the encapsulation layer ENCAP canhave a structure in which the first inorganic encapsulation layer PAS1,the organic encapsulation layer PCL, and the second inorganicencapsulation layer PAS2 are stacked in order.

Here, the organic encapsulation layer PCL can further comprise at leastone organic encapsulation layer or at least one inorganic encapsulationlayer.

The first inorganic encapsulation layer PAS1 is provided on thesubstrate SUB, on which the second electrode E2 corresponding to thecathode is provided, so as to be closest to the emitting device ED. Thefirst inorganic encapsulation layer PAS1 is made of an inorganicinsulating material, such as silicon nitride (SiNx), silicon oxide(SiOx), silicon oxynitride (SiON), or aluminum oxide (Al₂O₃), which canbe deposited at a low temperature. Since the first inorganicencapsulation layer PAS1 is deposited in a low-temperature atmosphere,the first inorganic encapsulation layer PAS1 can prevent the emittinglayer EL containing an organic material vulnerable to a high-temperatureatmosphere from being damaged during deposition processing.

The organic encapsulation layer PCL can be provided in an area smallerthan the area of the first inorganic encapsulation layer PAS1. In thiscase, the organic encapsulation layer PCL can be configured to exposeboth edges of the first inorganic encapsulation layer PAS1. The organicencapsulation layer PCL can serve as a buffer to reduce stress betweenthe layers caused by bending of the touch display device and serve toenhance planarization performance. The organic encapsulation layer PCLcan be made of, for example, an organic insulating material, such as anacrylic resin, an epoxy resin, polyimide, polyethylene, siliconoxycarbon (SiOC).

In addition, in a case in which the organic encapsulation layer PCL isfabricated by inkjet printing, one or more dams DAM can be provided inthe dam area DA corresponding to the boundary between the non-activearea NA and the active area AA or a portion of the non-active area NA.

For example, as illustrated in FIG. 9 , the dam area DA is locatedbetween a pad area in the non-active area NA and the active area AA. Thepad area refers to a portion of the non-active area NA in which theplurality of X-touch pads X-TP and the plurality of Y-touch pads Y-TPare provided. In the dam area DA, the first dam DAM1 adjacent to theactive area AA and the second dam DAM2 adjacent to the pad area can beprovided.

The one or more dams DAM disposed in the dam area DA can prevent theorganic encapsulation layer PCL in a liquid form from collapsing in thedirection of the non-active area NA and penetrating into the pad areawhen the organic encapsulation layer PCL in the liquid form is droppedto the active area AA.

This effect can be further increased by the provision of the first damDAM1 and the second dam DAM2 as illustrated in FIG. 9 .

At least one of the first dam DAM1 and the second dam DAM2 can have asingle layer or multilayer structure. For example, at least one of thefirst dam DAM1 and the second dam DAM2 can be simultaneously made ofsubstantially the same material as at least one of the banks BANK andspacers (not shown). In this case, a dam structure can be providedwithout additional mask processing or an increase in cost.

In addition, as illustrated in FIG. 9 , at least one of the first damDAM1 and the second dam DAM2 can have a structure in which at least oneof the first inorganic encapsulation layer PAS1 and the second inorganicencapsulation layer PAS2 is stacked on the banks BANK.

In addition, the organic encapsulation layer PCL containing an organicmaterial can be located on an inner side of the first dam DAM1, asillustrated in FIG. 9 .

Alternatively, the organic encapsulation layer PCL containing an organicmaterial can be located above at least a portion of the first dam DAM1and the second dam DAM2. For example, the organic encapsulation layerPCL can be located above the first dam DAM1.

The second inorganic encapsulation layer PAS2 can be provided on thesubstrate SUB on which the organic encapsulation layer PCL is provided,so as to cover the top surfaces and side surfaces of the organicencapsulation layer PCL and the first inorganic encapsulation layerPAS1. The second inorganic encapsulation layer PAS2 minimizes, reducesor prevents external moisture or oxygen from penetrating the firstinorganic encapsulation layer PAS1 or the organic encapsulation layerPCL. The second inorganic encapsulation layer PAS2 is made of, forexample, an inorganic insulating material, such as SiNx, SiOx, SiON, orAl₂O₃.

A touch buffer film T-BUF can be provided on the encapsulation layerENCAP. The touch buffer film T-BUF can be located between the touchsensor metal TSM, including the X and Y-touch electrodes X-TE and Y-TEand X and Y-touch electrode connecting lines X-CL and Y-CL, and thesecond electrode E2 of the emitting device ED.

The touch buffer film T-BUF can be designed to maintain a predeterminedminimum distance or selected distance (e.g., 1 μm) or more between thetouch sensor metal TSM and the second electrode E2 of the emittingdevice ED. Accordingly, this can reduce or prevent parasitic capacitancegenerated between the touch sensor metal TSM and the second electrode E2of the emitting device ED, thereby preventing touch sensitivity frombeing reduced by the parasitic capacitance.

Without the touch buffer film T-BUF, the touch sensor metal TSMcomprising the X and Y-touch electrodes X-TE and Y-TE and the X andY-touch electrode connecting lines X-CL and Y-CL can be disposed on theencapsulation layer ENCAP.

In addition, the touch buffer film T-BUF can prevent the emitting layerEL containing the organic material from being penetrated by a chemicalagent (e.g., a developing solution or an etching solution) used infabrication processing of the touch sensor metal TSM disposed on thetouch buffer film T-BUF, external moisture, or the like. Accordingly,the touch buffer film T-BUF can prevent the emitting layer EL vulnerableto the chemical agent or moisture from being damaged.

The touch buffer film T-BUF is made of an organic insulating materialproducible at a low temperature equal to or lower than a predeterminedtemperature or selected temperature (e.g., 100° C.) and having a lowdielectric constant of 1 to 3 in order to prevent the emitting layer ELcontaining the organic material vulnerable to high temperature frombeing damaged. For example, the touch buffer film T-BUF can be made ofan epoxy-based material or a siloxane-based material. The touch bufferfilm T-BUF made of an inorganic insulating material and having aplanarization performance can prevent the layers PAS1, PCL, and PAS2included in the encapsulation layer ENCAP from being damaged or thetouch sensor metal TSM on the touch buffer film T-BUF from beingfractured in response to the bending of the OLED display device.

According to the mutual capacitance-based touch sensor structure, theX-touch electrode lines X-TEL and the Y-touch electrode lines Y-TEL aredisposed on the touch buffer film T-BUF, and the X-touch electrode linesX-TEL and the Y-touch electrode lines Y-TEL can be disposed such thatthe X-touch electrode lines X-TEL overlap the Y-touch electrode linesY-TEL.

The Y-touch electrode lines Y-TEL can comprise the plurality of Y-touchelectrodes Y-TE and the plurality of Y-touch electrode connecting linesY-CL electrically connecting the plurality of Y-touch electrodes Y-TE.

As illustrated in FIG. 9 , the plurality of Y-touch electrodes Y-TE andthe plurality of Y-touch electrode connecting lines Y-CL can be disposedon different layers, on both sides of a touch insulating film T-ILD.

The plurality of Y-touch electrodes Y-TE can be spaced apart from eachother by predetermined distances or selected distances in the Y-axisdirection. Each of the plurality of Y-touch electrodes Y-TE can beelectrically connected to the other adjacent Y-touch electrodes Y-TEthrough the Y-touch electrode connecting lines Y-CL in the Y-axisdirection.

The Y-touch electrode connecting lines Y-CL can be provided on the touchbuffer film T-BUF and exposed through touch contact holes extendingthrough the touch insulating film T-ILD to be electrically connected tothe two adjacent Y-touch electrodes Y-TE in the Y-axis direction.

The Y-touch electrode connecting lines Y-CL can be disposed to overlapthe banks BANK. Accordingly, the aperture ratio can be prevented frombeing decreased by the Y-touch electrode connecting lines Y-CL.

The X-touch electrode lines X-TEL can comprise the plurality of X-touchelectrodes X-TE and the plurality of X-touch electrode connecting linesX-CL electrically connecting the plurality of X-touch electrodes X-TE.The plurality of X-touch electrodes X-TE and the plurality of X-touchelectrode connecting line X-CL can be disposed on different layers, onboth sides of the touch insulating film T-ILD.

The plurality of X-touch electrodes X-TE can be disposed on the touchinsulating film T-ILD, spaced apart from each other by predetermineddistances or selected distances in the X-axis direction. Each of theplurality of X-touch electrodes X-TE can be electrically connected tothe adjacent other X-touch electrodes X-TE through the X-touch electrodeconnecting lines X-CL in the X-axis direction.

The X-touch electrode connecting lines X-CL can be disposed onsubstantially the same plane as the X-touch electrodes X-TE to beelectrically connected to the two adjacent X-touch electrodes X-TE inthe X-axis direction without separate contact holes or be integratedwith the two adjacent X-touch electrodes X-TE in the X-axis direction.

The X-touch electrode connecting lines X-CL can be disposed to overlapthe banks BANK. Accordingly, the aperture ratio can be prevented frombeing decreased by the X-touch electrode connecting lines X-CL.

In addition, the Y-touch electrode lines Y-TEL can be electricallyconnected to the touch driving circuit TDC through the Y-touch routinglines Y-TL and the Y-touch pads Y-TP. In the same manner, the X-touchelectrode lines X-TEL can be electrically connected to the touch drivingcircuit TDC through the X-touch routing lines X-TL and the X-touch padsX-TP.

A pad cover electrode covering the X-touch pads X-TP and the Y-touchpads Y-TP can be further disposed.

The X-touch pads X-TP can be provided separately from the X-touchrouting lines X-TL or be provided as extensions of the X-touch routinglines X-TL. The Y-touch pads Y-TP can be provided separately from theY-touch routing lines Y-TL or be provided as extensions of the Y-touchrouting lines Y-TL.

In a case in which the X-touch pads X-TP are extensions of the X-touchrouting lines X-TL and the Y-touch pads Y-TP are extensions of theY-touch routing lines Y-TL, the X-touch pads X-TP, the X-touch routinglines X-TL, the Y-touch pads Y-TP, and the Y-touch routing lines Y-TLcan comprise substantially the same material, e.g., a first conductivematerial. The first conductive material can have a single or multilayerstructure made of a metal, such as Al, Ti, Cu, or Mo, having highcorrosion resistance, high acid resistance, and high conductivity.

For example, each of the X-touch pads X-TP, the X-touch routing linesX-TL, the Y-touch pads Y-TP, and the Y-touch routing lines Y-TLcomprised of the first conductive material can have a three-layerstructure, such as Ti/Al/Ti or Mo/Al/Mo.

The pad cover electrode capable of covering the X-touch pads X-TP andthe Y-touch pads Y-TP can comprised substantially the same material asthe X and Y-touch electrodes X-TE and Y-TE, e.g., a second conductivematerial. The second conductive material can be a transparent conductivematerial, such as indium tin oxide (ITO) or indium zinc oxide (IZO),having high corrosion resistance and acid resistance. The pad coverelectrodes can be provided to be exposed from the touch buffer filmT-BUF so as to be bonded to the touch driving circuit TDC or to acircuit film on which the touch driving circuit TDC is mounted.

The touch buffer film T-BUF can be provided to cover the touch sensormetal TSM so as to prevent the touch sensor metal TSM from beingcorroded by external moisture. For example, the touch buffer film T-BUFcan be made of an organic insulating material or be provided as acircular polarizer or a film made of an epoxy or acrylic material. Thetouch buffer film T-BUF may not be provided on the encapsulation layerENCAP. That is, the touch buffer film T-BUF may be an optionalcomponent.

The Y-touch routing lines Y-TL can be electrically connected to theY-touch electrodes Y-TE via touch routing line contact holes or beintegrated with the Y-touch electrodes Y-TE.

Each of the Y-touch routing lines Y-TL can extend to the non-active areaNA, past the top and side portions of the encapsulation layer ENCAP andthe dams DAM, so as to be electrically connected to the Y-touch padsY-TP. Accordingly, the Y-touch routing lines Y-TL can be electricallyconnected to the touch driving circuit TDC through the Y-touch padsY-TP.

The Y-touch routing lines Y-TL can deliver the touch-sensing signal fromthe Y-touch electrodes Y-TE to the touch driving circuit TDC or deliverthe touch driving signal, received from the touch driving circuit TDC,to the Y-touch electrodes Y-TE.

The X-touch routing lines X-TL can be electrically connected to theX-touch electrodes X-TE via the touch routing line contact holes or beintegrated with the X-touch electrodes X-TE.

The X-touch routing lines X-TL can extend to the non-active area NA,past the top and side portions of the encapsulation layer ENCAP and thedams DAM, so as to be electrically connected to the X-touch pads Y-TP.Accordingly, the X-touch routing lines X-TL can be electricallyconnected to the touch driving circuit TDC through the X-touch padsX-TP.

The X-touch routing lines X-TL can deliver the touch driving signal,received from the touch driving circuit TDC, to the X-touch electrodesX-TE or deliver touch-sensing signal from the X-touch electrodes X-TE tothe touch driving circuit TDC.

The arrangement of the X-touch routing lines X-TL and the Y-touchrouting lines Y-TL can be modified variously depending on the designspecification of the panel.

A touch protective film PAC can be disposed on the X-touch electrodesX-TE and the Y-touch electrodes Y-TE. The touch protective film PAC canextend to an area in front of or behind the dams DAM so as to bedisposed on the X-touch routing lines X-TL and the Y-touch routing linesY-TL.

The cross-sectional diagram of FIG. 9 is conceptual illustration of thestructure. The positions, thicknesses, or widths of the patterns (e.g.,various layers or electrodes) can vary depending on the direction orposition of view, the structures for connecting the patterns can bemodified, additional layers other than the plurality of illustratedlayers can be further provided, and some of the plurality of illustratedlayers can be omitted or integrated. For example, the width of the banksBANK can be narrower than that illustrated in the drawings, and theheight of the dams DAM can be lower or higher than that illustrated inthe drawings. In addition, the cross-sectional diagram of FIG. 9illustrates a structure in which the touch electrode TE, the touchrouting lines TL, and the like are disposed on the entirety of thesubpixels SP in order to illustrate a structure connected to the touchpads TP along inclines of the touch routing lines TL and theencapsulation layer ENCAP. However, in a case in which the touchelectrode TE or the like is mesh-shaped as described above, the openareas OA of the touch electrode TE can be located above the emittingareas of the subpixels SP. In addition, a color filter CF (see FIGS. 10and 11 ) can be further disposed on the encapsulation layer ENCAP. Thecolor filter CF can be located on the touch electrode TE or between theencapsulation layer ENCAP and the touch electrode TE.

Furthermore, in the case that the non-active area NA of the displaypanel DISP is bent, an area where the display panel DISP is bent can bepresent between the touch pad TP and the dam DAM. The touch pad TP canbe located between the area where the display panel DISP is bent and anouter boundary of the display panel DISP on the non-active area NA ofthe display panel DISP.

FIGS. 10 and 11 are diagrams illustrating a cross-sectional structure ofthe display panel DISP according to embodiments of the presentdisclosure, including the color filter CF.

Referring to FIGS. 10 and 11 , in a case in which the touch panel TSP isdisposed within the display panel DISP and the display panel DISP isprovided as an OLED display panel, the touch panel TSP can be located onthe encapsulation layer ENCAP in the display panel DISP. That is, thetouch sensor metals TSM, such as the plurality of touch electrodes TEand the plurality of touch routing lines TL, can be located on theencapsulation layer ENCAP in the display panel DISP.

The touch electrode TE being provided on the encapsulation layer ENCAPas described above can be made as the touch electrode TE withoutsignificantly influencing the display performance or the formation of adisplay-related layer.

Referring to FIGS. 10 and 11 , the second electrode E2 that can be thecathode of the OLED can be located below the encapsulation layer ENCAP.

The thickness T of the encapsulation layer ENCAP can be, for example, 1μm or more.

Since the thickness of the encapsulation layer ENCAP is designed to be 1μm or more as described above, parasitic capacitance generated betweenthe second electrode E2 of the OLED and the touch electrodes TE can bereduced, thereby preventing touch sensitivity from being reduced by theparasitic capacitance.

As described above, each of the plurality of touch electrodes TE ispatterned in the shape of a mesh, in which the electrode metal EM hastwo or more open areas OA. Each of the two or more open areas OA cancorrespond to one or more subpixels or the emitting areas thereof whenviewed in a vertical direction.

As described above, the electrode metal EM of the touch electrode TE canbe patterned such that the emitting area of one or more subpixels SP isprovided in a position corresponding to each of the two or more openareas OA present in the area of the touch electrode TE when viewed in aplan view. Accordingly, the luminous efficiency of the display panelDISP can be improved.

As illustrated in FIGS. 10 and 11 , a black matrix BM can be provided inthe display panel DISP. The color filter CF can be further provided inthe display panel DISP.

The position of the black matrix BM can correspond to the position ofthe electrode metal EM of the touch electrode TE.

The positions of the plurality of color filters CF correspond to thepositions of the plurality of touch electrodes TE or the position of theplurality of open areas OA in the electrode metal EM constituting theplurality of touch electrodes TE.

Since the plurality of color filters CF are located in positionscorresponding to the plurality of open areas OA as described above, theluminous performance of the display panel DISP can be improved.

The vertical positional relationship between the plurality of colorfilters CF and the plurality of touch electrodes TE will be described asfollows.

As illustrated in FIG. 10 , the plurality of color filters CF and theblack matrix BM can be located on the plurality of touch electrodes TE.

In this case, the plurality of color filters CF and the black matrix BMcan be located on the overcoat layer OC disposed on the plurality oftouch electrodes TE. Here, the overcoat layer OC can be the same layeras or a different layer from the touch protective film PAC illustratedin FIG. 9 .

Alternatively, as illustrated in FIG. 11 , the plurality of colorfilters CF and the black matrix BM can be located below the plurality oftouch electrodes TE.

In this case, the plurality of touch electrodes TE can be located on theovercoat layer OC on the plurality of color filters CF and the blackmatrix BM. The overcoat layer OC can be the same layer as or a differentlayer from the touch buffer film T-BUF or the touch insulating filmT-ILD illustrated in FIG. 9 . Alternatively, the touch buffer film T-BUFor the touch insulating film T-ILD can be disposed in a manner separatefrom the overcoat layer OC.

Due to the vertical positional relationship between the touch electrodeTE and a display driving configuration being adjusted as describedabove, a touch sensing configuration can be disposed without degradingthe display performance.

Meanwhile, in the non-active area NA of the display panel DISP, theremay be disposed a plurality of touch routing lines TL electricallyconnecting between the touch electrode line TEL and the touch drivingcircuit TDC.

The touch routing line TL may be located on the encapsulation layerENCAP in the non-active area NA.

Since the encapsulation layer ENCAP may gradually decrease in thicknessin the non-active area NA, the touch routing line TL may be located onan inclined portion of the encapsulation layer ENCAP in the non-activearea NA.

FIG. 12 is a diagram illustrating an example of a structure in which atouch routing line TL is disposed in a non-active area NA of a displaypanel DISP according to embodiments of the present disclosure.

Referring to FIG. 12 , as illustrated in (a), the touch routing line TLcan be disposed on an inclined portion of the encapsulation layer ENCAP.A display signal line DSL for supplying a signal or voltage for drivinga display may be disposed under the encapsulation layer ENCAP.

A parasitic capacitance Cp may be formed between the touch routing lineTL located on the encapsulation layer ENCAP and the display signal lineDSL located under the encapsulation layer ENCAP. Since such parasiticcapacitance may act as noise of a touch sensing signal detected throughthe touch routing line TL, touch sensing accuracy may deteriorates.

In particular, since the distance between the touch routing line TL andthe display signal line DSL disposed in a portion having a smallthickness of the encapsulation layer ENCAP is small, the parasiticcapacitance may be the largest.

In addition, the distance between the touch routing line TL and thedisplay signal line DSL is different depending on the location, so thatparasitic capacitance deviation may be generated. In this case, theremay be difficult to implement a structure capable of accurate touchsensing due to the parasitic capacitance deviation.

In this case, as the example illustrated in (b), the touch routing lineTL can be disposed in a planarized area of the encapsulation layerENCAP. However, in this case, the non-active area NA of the displaypanel DISP may increase due to an increase in the area where theencapsulation layer ENCAP is disposed.

Embodiments of the present disclosure can provide a solution forimproving the performance of touch sensing by reducing the parasiticcapacitance between the touch routing line TL and the display signalline DSL without increasing the non-active area NA.

FIG. 13 is a diagram illustrating another example of a structure inwhich a touch routing line TL is disposed in a non-active area NA of adisplay panel DISP according to embodiments of the present disclosure.

Referring to FIG. 13 , a touch planarization film BPAC can be disposedon at least a partial area on an inclined portion of the encapsulationlayer ENCAP in the non-active area NA of the display panel DISP.

The touch planarization film BPAC, for example, can be disposed on fouredge areas of the display panel DISP. The touch planarization film BPACcan be formed of, for example, an organic material.

The touch routing line TL can be disposed on the touch planarizationfilm BPAC.

Accordingly, as the touch planarization film BPAC is disposed on theinclined portion of the encapsulation layer ENCAP, it is possible toprevent the distance between the touch routing line TL and the displaysignal line DSL from getting closer.

In addition, as the touch routing line TL is disposed on the touchplanarization film BPAC, a distance between the touch routing line TLand the display signal line DSL can increase.

There can be reduced the parasitic capacitance between the touch routingline TL and the display signal line DSL due to an increase in thedistance between the touch routing line TL and the display signal lineDSL.

In addition, the deviation of the parasitic capacitance between thetouch routing line TL and the display signal line DSL also can bereduced.

There can be reduced a difference in a parasitic capacitance between thetouch routing line TL located closest to the active area AA and thedisplay signal line DSL, and a parasitic capacitance between the touchrouting line TL located farthest from the active area AA and the displaysignal line DSL.

Accordingly, it is possible to prevent the performance of touch sensingfrom being deteriorated due to an increase in the parasitic capacitancebetween the touch routing line TL and the display signal line DSL, or anincrease in the deviation of the parasitic capacitance.

Furthermore, since the influence by the parasitic capacitance can bereduced, it is possible to increase the width of the touch routing lineTL, thereby reducing the resistance of the touch routing line TL.

The boundary point of the touch planarization film BPAC can be appliedby a slit and half-tone exposure without affecting a subsequent process.In addition, since the touch planarization film BPAC covers the inclinedportion of the encapsulation layer ENCAP, there can be improved aforeign material defect in the corresponding area.

As described above, in the embodiments of the present disclosure, thetouch planarization film is located between the inclined portion of theencapsulation layer ENCAP and the touch routing line TL in thenon-active area NA of the display panel DISP, so that it is possible toreduce the parasitic capacitance between the touch routing line TL andthe display signal line DSL without increasing the non-active area NA.

The touch planarization film BPAC can be disposed in all four edge areasof the display panel DISP as in the above-described example, but in somecases, it may be located only in some of the four edge areas of thedisplay panel DISP.

FIG. 14 is a diagram illustrating another example of a structure inwhich a touch routing line TL is disposed in a non-active area NA of adisplay panel DISP according to embodiments of the present disclosure.

Referring to FIG. 14 , a touch planarization film BPAC can be disposedon some of the four edge areas of the display panel DISP.

For example, the touch planarization film BPAC can be disposed in upper,left, and right edge areas of the display panel DISP. In some cases, thetouch planarization film BPAC can be disposed only in left and rightedge areas of the display panel DISP.

The area in which the touch planarization film BPAC is disposed can havea cross-sectional structure as illustrated in (a).

The touch planarization film BPAC is disposed in the area where thetouch routing line TL is disposed, and can be disposed in an areaexcluding the area where the touch routing line TL extends to beconnected to a touch pad TP.

The touch pad TP can be disposed in a lower edge area of the displaypanel DISP. Alternatively, the touch pad TP can be disposed in an areaafter being bent in a structure in which the lower edge area of thedisplay panel DISP is bent.

A gentle slope can be formed since the touch planarization film BPAC isnot disposed in an area where the touch routing line TL extends to beconnected to the touch pad TP.

In this case, as in the example illustrated in (b), the touch routingline TL can be disposed along the gently inclined surface, so that therecan be prevented a crack defect of the touch routing line TL.

Accordingly, a part of the plurality of touch routing lines TL can bedisposed on the touch planarization film BPAC, and another part can bedisposed on an inclined portion of the encapsulation layer ENCAP.

Also, a part of the plurality of touch routing lines TL can include aportion disposed on the touch planarization film BPAC and a portiondisposed on an inclined portion of the encapsulation layer ENCAP.

Therefore, there can be adjusted the area in which the touchplanarization film BPAC is disposed in the non-active area NA, so thatit is possible to reduce the parasitic capacitance between the touchrouting line TL and the display signal line DSL and prevent theoccurrence of crack defects of the touch routing line TL.

In addition, it is possible to implement various structures in which thetouch routing line TL is easily disposed while reducing the parasiticcapacitance between the touch routing line TL and the display signalline DSL by using the thickness adjustment of the touch planarizationfilm BPAC disposed on the encapsulation layer ENCAP.

FIGS. 15 to 17 are diagrams illustrating specific structures in whichtouch routing line TL is disposed in a non-active area NA of a displaypanel DISP according to embodiments of the present disclosure.

Referring to FIG. 15 , a first transistor T1 or a light emitting deviceED for driving a display can be disposed in the active area AA. Also,although not shown, a touch electrode TE can be disposed on theencapsulation layer ENCAP in the active area AA. In addition, severalinsulating films including the buffer film BUF can be disposed, and itwill be omitted descriptions of portions overlapping with thosedescribed with reference to FIG. 9 .

A plurality of display signal lines DSL can be disposed under theencapsulation layer ENACAP in the non-active area NA. The display signalline DSL can be, for example, a clock signal line or a line supplying adriving voltage, but is not limited thereto.

A touch planarization film BPAC can be disposed on the encapsulationlayer ENCAP in the non-active area NA.

A touch buffer film T-BUF can be disposed on the touch planarizationfilm BPAC. The touch buffer film T-BUF can be disposed on theencapsulation layer ENCAP in the active area AA and disposed on thetouch planarization film BPAC in the non-active area NA.

The touch routing line TL can be disposed on the touch buffer film T-BUFdisposed on the touch planarization film BPAC.

The touch planarization film BPAC can be located outside the active areaAA.

The touch planarization film BPAC can be disposed so as not to deviatefrom an outermost boundary of a dam DAM.

The touch planarization film BPAC can include a first portion BPAC1which is a planarized portion and a second portion BPAC2 which is aninclined portion.

The first portion BPAC1 of the touch planarization film BPAC can belocated adjacent to the active area AA.

The second portion BPAC2 of the touch planarization film BPAC can belocated adjacent to the dam DAM.

The upper end of the first portion BPAC1 of the touch planarization filmBPAC can be located at substantially the same level as the upper end ofthe encapsulation layer ENCAP. Alternatively, the upper end of the firstportion BPAC1 of the touch planarization film BPAC can be positionedslightly lower than the upper end of the encapsulation layer ENCAP.

The touch planarization film BPAC is formed to a predetermined thicknessor selected thickness or more, so that it is possible to reduceparasitic capacitance between the touch routing line TL and the displaysignal line DSL located under the encapsulation layer ENCAP.

Since the upper end of the touch planarization film BPAC is locatedequal to or slightly lower than the upper end of the encapsulation layerENCAP, there can be facilitated a process of disposing the touchelectrode TE and the touch routing line TL on the touch buffer filmT-BUF.

Closer to the active area AA, the thickness of the first portion BPAC1of the touch planarization film BPAC may decrease.

For example, the thickness Th1 of the first portion BPAC1 of the touchplanarization film BPAC disposed under the touch routing line TL locatedclosest to the active area AA can be smaller than a thickness Th2 of thefirst portion BPAC1 of the touch planarization film BPAC disposed underthe touch routing line TL located far from the active area AA.

The step difference of the encapsulation layer ENCAP in the non-activearea NA can be compensated by adjusting the thickness of the touchplanarization film BPAC.

The second portion BPAC2 of the touch planarization film BPAC is aninclined portion, and the touch routing line TL may not be disposed onthe second portion BPAC2 of the touch planarization film BPAC.

The slope of the second portion BPAC2 which is the inclined portion ofthe touch planarization film BPAC can be different from the slope of theinclined portion of the encapsulation layer ENCAP.

For example, the slope of the second portion BPAC2 of the touchplanarization film BPAC may be greater than the slope of the inclinedportion of the encapsulation layer ENCAP. The inclination angle θ2 ofthe second portion BPAC2 of the touch planarization film BPAC may begreater than the inclination angle θ1 of the inclined portion of theencapsulation layer ENCAP.

Since the slope of the touch planarization film BPAC is greater than theslope of the encapsulation layer ENCAP, the step difference of theencapsulation layer ENCAP can be compensated by the touch planarizationfilm BPAC.

In some cases, the upper end of the touch planarization film BPAC can bepositioned lower than the upper end of the encapsulation layer ENCAPwhile compensating for the step difference of the encapsulation layerENCAP by the touch planarization film BPAC.

Referring to FIG. 16 , a touch planarization film BPAC can be disposedon an inclined portion of the encapsulation layer ENCAP in thenon-active area NA of the display panel DISP.

A plurality of display signal lines DSL can be disposed under theencapsulation layer ENCAP.

A touch buffer film T-BUF can be disposed on a touch planarization filmBPAC.

A portion of the touch buffer film T-BUF can be disposed on theencapsulation layer ENCAP, and another portion can be disposed on thetouch planarization film BPAC.

The touch planarization film BPAC can be disposed between theencapsulation layer ENCAP and the touch buffer film T-BUF in thenon-active area NA.

The touch planarization film BPAC can include a planarized portion andan inclined portion.

A touch routing line TL may be disposed on the planarized portion of thetouch planarization film BPAC.

The upper end of the touch planarization film BPAC can be positionedlower than the upper end of the encapsulation layer ENCAP by apredetermined distance D or selected distance D.

Since the upper end of the touch planarization film BPAC is positionedlower than the upper end of the encapsulation layer ENCAP, a part of theplurality of touch routing lines TL can be disposed on the encapsulationlayer ENCAP.

Since the touch routing line TL is disposed on the encapsulation layerENCAP located higher than the touch planarization film BPAC, or disposedon the planarized portion of the touch planarization film BPAC, theparasitic capacitance between the touch routing line TL and the displaysignal line DSL can be reduced. In addition, a parasitic capacitancedeviation between the touch routing lines TL can be reduced.

Since the influence of parasitic capacitance between the touch routingline TL and the display signal line DSL is reduced, it is possible toimprove the performance of touch sensing. In addition, the resistance ofthe touch routing line TL can be reduced by increasing the width of thetouch routing line TL.

Since the upper end of the touch planarization film BPAC is locatedlower than the upper end of the encapsulation layer ENCAP by apredetermined distance or selected distance while increasing a distancebetween the touch routing line TL and the display signal line DSL by thearrangement of the touch planarization film BPAC, it is possible toeasily arrange an electrode metal EM forming the touch electrode lineTEL and the touch routing line TL on the encapsulation layer ENCAP andthe touch planarization film BPAC.

In addition, in the case that the touch routing line TL extends from thetouch planarization film BPAC and is disposed passing a dam DAM, therecan be reduced the slope of the touch planarization film BPAC adjacentto the dam DAM, thereby also preventing a crack defect of the touchrouting line TL.

As described above, by adjusting the thickness of the touchplanarization film BPAC disposed on the inclined portion of theencapsulation layer ENCAP in the non-active area NA, it is possible toprevent deterioration of touch sensing performance due to parasiticcapacitance and facilitate arrangement of the electrode metal EM fortouch sensing.

A touch protective film PAC can be disposed on an area in which thetouch electrode TE and the touch routing line TL are disposed in theactive area AA and the non-active area NA. The touch protective film PACcan be disposed to overlap the touch planarization film BPAC disposed inthe non-active area NA.

Referring to FIG. 17 , the touch planarization film BPAC can be disposedin at least a partial area of the area overlapping the inclined portionof the encapsulation layer ENCAP in the non-active area NA.

The touch planarization film BPAC can include a planarized portion andan inclined portion. The thickness of the planarized portion of thetouch planarization film BPAC can decrease as it approaches the activearea. The upper end of the touch planarization film BPAC can be locatedlower than an upper end of the encapsulation layer ENCAP.

A touch buffer film T-BUF can be disposed on the encapsulation layerENCAP and the touch planarization film BPAC.

A touch routing line TL can be disposed on the touch buffer film T-BUF.

The touch routing line TL can be disposed on an area overlapping theplanarized portion of the touch planarization film BPAC.

A touch protective film PAC can be disposed on the touch routing lineTL. The touch protective film PAC may be made of substantially the samematerial as the touch planarization film BPAC, but is not limitedthereto.

The touch protective film PAC can protect the touch electrode TEdisposed in the active area AA and the touch routing line TL disposed inthe non-active area NA.

The touch protective film PAC can be disposed in an area including aregion overlapping the touch planarization film BPAC. For example, theouter edge of the touch protective film PAC may overlap the outer edgeof the touch planarization film BPAC or may be located outside the outeredge of the touch planarization film BPAC.

Since the touch protective film PAC is disposed in a state in which thetouch planarization film BPAC is disposed on the inclined portion of theencapsulation layer ENCA, the thickness of the touch protective film PACcan be reduced. The transmittance of light emitted from the active areaAA to the outside can be increased by reducing the thickness of thetouch protective film PAC.

According to the above-described embodiments of the present disclosure,the touch planarization film BPAC is disposed on the inclined portion ofthe encapsulation layer ENCAP in the non-active area NA of the displaypanel DISP, so that it is possible to compensate a step difference inthe inclined portion of the encapsulation layer ENCAP.

In addition, by arranging the touch routing line TL on the planarizedportion of the touch planarization film BPAC, it is possible to reducethe parasitic capacitance between the touch routing line TL and thedisplay signal line DSL disposed under the encapsulation layer ENCAPwithout increasing the non-active area NA.

Further, it is possible to reduce the parasitic capacitance deviationbetween the touch routing lines TL and easily adjust the width of thetouch routing line TL, thereby reducing the load of the touch routingline TL and improving the performance of touch sensing.

The above description has been presented to enable any person skilled inthe art to make and use the technical idea of the present disclosure,and has been provided in the context of a particular application and itstechnical benefits. Various modifications, additions and substitutionsto the described embodiments will be readily apparent to those skilledin the art, and the general principles described herein may be appliedto other embodiments and applications without departing from the spiritand scope of the present disclosure. The above description and theaccompanying drawings provide an example of the technical idea of thepresent disclosure for illustrative purposes only. That is, thedisclosed embodiments are intended to illustrate the scope of thetechnical idea of the present disclosure. Thus, the scope of the presentdisclosure is not limited to the embodiments shown, but is to beaccorded the widest scope consistent with the claims. The scope ofprotection of the present disclosure should be construed based on thefollowing claims, and all technical ideas within the scope ofequivalents thereof should be construed as being included within thescope of the present disclosure.

The various embodiments described above can be combined to providefurther embodiments. All of the U.S. patents, U.S. patent applicationpublications, U.S. patent applications, foreign patents, foreign patentapplications and non-patent publications referred to in thisspecification and/or listed in the Application Data Sheet areincorporated herein by reference, in their entirety. Aspects of theembodiments can be modified, if necessary to employ concepts of thevarious patents, applications and publications to provide yet furtherembodiments.

These and other changes can be made to the embodiments in light of theabove-detailed description. In general, in the following claims, theterms used should not be construed to limit the claims to the specificembodiments disclosed in the specification and the claims, but should beconstrued to include all possible embodiments along with the full scopeof equivalents to which such claims are entitled. Accordingly, theclaims are not limited by the disclosure.

The invention claimed is:
 1. A touch display device comprising: anencapsulation layer disposed on at least a portion of a non-active areaand an active area, the encapsulation layer having an upper surface andincluding an inclined portion located in the non-active area; aplurality of touch electrodes located on the encapsulation layer in theactive area; a plurality of touch routing lines located on theencapsulation layer in the non-active area, each of the plurality oftouch routing lines being electrically coupled to at least one of theplurality of touch electrodes; a touch planarization film disposed onthe encapsulation layer, the touch planarization film having an uppersurface and being located in at least a portion of an area overlappingthe inclined portion of the encapsulation layer, and being located underthe plurality of touch routing lines; and first and second dams locatedin the non-active area, wherein the first dam is located between thesecond dam and the active area; wherein the touch planarization film isdisposed to not extend beyond an outermost boundary of the second dam,wherein the upper surface of the touch planarization film is located ata level lower than the upper surface of the encapsulation layer, andwherein the touch planarization film includes an inclined surface thatoverlaps a sidewall of the second dam that faces the first dam and doesnot overlap an upper surface of the second dam.
 2. The touch displaydevice of claim 1, wherein the touch planarization film comprises: afirst portion that is planarized; and a second portion that is inclined,the plurality of touch routing lines being located on the first portionof the touch planarization film.
 3. The touch display device of claim 2,wherein the plurality of touch routing lines are located in an areaoutside an area overlapping the second portion of the touchplanarization film.
 4. The touch display device of claim 2, wherein aslope of the second portion of the touch planarization film is greaterthan a slope of the inclined portion of the encapsulation layer.
 5. Thetouch display device of claim 2, further comprising a plurality ofdisplay signal lines located under the encapsulation layer, wherein atleast a part of the plurality of display signal lines is located in anarea overlapping the first portion of the touch planarization film. 6.The touch display device of claim 1, wherein the touch planarizationfilm is located in an area between the active area and an outermostboundary of the second dam.
 7. The touch display device of claim 1,further comprising a touch buffer film disposed between the touchplanarization film and the plurality of touch routing lines.
 8. Thetouch display device of claim 7, wherein the touch buffer film isfurther located between the encapsulation layer and the plurality oftouch electrodes in the active area.
 9. The touch display device ofclaim 1, further comprising a touch protective film disposed on theplurality of touch electrodes and the plurality of touch routing lines,wherein the touch planarization film is located in an area overlappingan area in which the touch protective film is disposed.
 10. A touchdisplay device comprising: an encapsulation layer disposed on at least aportion of a non-active area and an active area, the encapsulation layerhaving an upper surface and including an inclined portion located in thenon-active area; a touch buffer film located on the encapsulation layer;a plurality of touch electrodes and a plurality of touch routing lines,the plurality of touch electrodes and the plurality of touch routinglines each disposed on the touch buffer film; a touch planarization filmdisposed in the non-active area, the touch planarization film having anupper surface and a portion disposed between at least a portion of theinclined portion of the encapsulation layer and the touch buffer film;and first and second dams located in the non-active area, wherein thefirst dam is located between the second dam and the active area; whereinthe touch planarization film is disposed to not extend beyond anoutermost boundary of the second dam, wherein the upper surface of thetouch planarization film is located at a level lower than the uppersurface of the encapsulation layer, and wherein the touch planarizationfilm includes an inclined surface that terminates on a sidewall of thesecond dam that faces the first dam.
 11. The touch display device ofclaim 10, wherein at least some of the plurality of touch routing linesare located in an area overlapping the touch planarization film.
 12. Thetouch display device of claim 10, wherein a thickness of the touchplanarization film located under a touch routing line most adjacent tothe active area among the plurality of touch routing lines is less thana thickness of the touch planarization film located under a touchrouting line located farthest from the active area among the pluralityof touch routing lines.
 13. The touch display device of claim 10,wherein a portion of the touch planarization film is an inclinedportion, and a slope of the inclined portion of the touch planarizationfilm is greater than a slope of the inclined portion of theencapsulation layer.
 14. The touch display device of claim 13, whereinthe plurality of touch routing lines are located in an area outside anarea overlapping the inclined portion of the touch planarization film.15. The touch display device of claim 10, wherein at least some of theplurality of touch routing lines are disposed along a surface of theinclined portion of the encapsulation layer.
 16. The touch displaydevice of claim 10, wherein at least one of the plurality of touchrouting lines comprises: a first portion located in an area overlappingthe touch planarization film; and a second portion located on theinclined portion of the encapsulation layer.
 17. The touch displaydevice of claim 1, further comprising a plurality of touch pads disposedon the at least a portion of the non-active area and connected to theplurality of touch routing lines, wherein the touch planarization filmis disposed excluding the area where the plurality of touch routinglines extends to be connected to the plurality of touch pads.
 18. Thetouch display device of claim 10, further comprising a plurality oftouch pads disposed on the at least a portion of the non-active area andconnected to the plurality of touch routing lines, wherein the touchplanarization film is disposed excluding the area where the plurality oftouch routing lines extends to be connected to the plurality of touchpads.
 19. The touch display device of claim 17, wherein theencapsulation layer comprises a first inorganic encapsulation layer, anorganic encapsulation layer, and a second inorganic encapsulation layer,and the first inorganic encapsulation layer and the second inorganicencapsulation layer are between the first and second dams and theplurality of touch pads.
 20. A touch display device comprising: anencapsulation layer disposed on at least a portion of a non-active areaand an active area, the encapsulation layer having an upper surface andincluding an inclined portion located in the non-active area; aplurality of touch routing lines located on the encapsulation layer inthe non-active area, each of the plurality of touch routing linesoverlapping the inclined portion of the encapsulation layer; a touchplanarization film disposed on the encapsulation layer, the touchplanarization film having a first portion having a planarized uppersurface and being located in at least a portion of an area overlappingthe inclined portion of the encapsulation layer, and a second portionhaving an inclined surface, the plurality of touch routing lines beinglocated on the first portion; a bank having an opening corresponding toa light emitting device in the active area, the bank having a portionthat extends into the non-active area; a display signal line, at leastone of the plurality of touch routing lines overlapping the displaysignal line, the display signal line being separated from the at leastone of the plurality touch routing lines by the portion of the bank inthe non-active area, the inclined portion of the encapsulation layer andthe first portion of the touch planarization film; and at least one damlocated in the non-active area.
 21. The touch display device of claim20, further comprising a second touch routing line on the encapsulationlayer and laterally offset from the touch planarization layer.
 22. Thetouch display device of claim 21, wherein the second touch routing lineis located higher than the plurality of touch routing lines located onthe touch planarization film.